Honor Magic V Flip Price in Japan

Honor Magic V Flip Full Mobile Specifications

• Network
  Technology: GSM / CDMA / HSPA / CDMA2000 / LTE / 5G

• Launch
  Announced: 2024, June 13
  Status: Available. Released 2024, June 19

• Body
  Dimensions: Unfolded: 167.3 x 75.6 x 7.2 mm
  Folded: 86.5 x 75.6 x 14.9 mm
  Weight: 193 g (6.81 oz)
  Build: Aluminum frame
  SIM: Dual SIM (Nano-SIM, dual stand-by)

• Display
  Type: Foldable LTPO OLED, 1B colors, 120Hz, HDR, Dolby Vision, BT.2020, 3000 nits (peak)
  Size: 6.8 inches, 108.0 cm² (~85.4% screen-to-body ratio)
  Resolution: 1080 x 2520 pixels, 21:9 ratio (~403 ppi density)
  - : Cover display:
  LTPO OLED, 4 inch, 1200 x 1092 pixels, 405 ppi, 120Hz, HDR, Dolby Vision, 1600 nits (HBM)

• Platform
  OS: Android 14, MagicOS 8
  Chipset: Qualcomm SM8475 Snapdragon 8+ Gen 1 (4 nm)
  CPU: Octa-core (1x3.0 GHz Cortex-X2 & 3x2.5 GHz Cortex-A710 & 4x1.80 GHz Cortex-A510)
  GPU: Adreno 730

• Memory
  Card slot - No
  Internal: 256GB 12GB RAM, 512GB 12GB RAM, 1TB 12GB RAM, 1TB 16GB RAM

• Main Camera
  Dual: 50 MP, f/1.9, 23mm (wide), 1/1.56", 1.0µm, PDAF, OIS
  12 MP, f/2.2, 112˚ (ultrawide), AF
  Features: LED flash, HDR, panorama
  Video: 4K, 1080p, gyro-EIS

• Selfie camera
  Single: 50 MP, f/2.0, (wide), AF
  Video: 4K, 1080p

• Sound
  Loudspeaker : Yes, with stereo speakers
  3.5mm jack : No

• Comms
  WLAN: Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
  Bluetooth: 5.3, A2DP, LE, aptX HD
  Positioning: GPS, GALILEO, GLONASS, QZSS, BDS (B1I+B1c)
  NFC: Yes
  Radio: No
  USB: USB Type-C 2.0, OTG

• Features
  Sensors: Fingerprint (side-mounted), gyro, accelerometer, proximity (ultrasonic), compass

• Battery
  Type: Si/C 4800 mAh, non-removable
  Charging: 66W wired, 45% in 15 min (advertised)
  5W reverse wired

• Misc
  Colors: Black, White, Champagne, Green
  Models: LRA-AN00
  Price: About 640 EUR